To ensure these electronic components survive common environmental threats, innovative non-destructive testing is needed to verify surface cleanliness and guarantee adhesion.
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Guarantee surface cleanliness prior to adhesion processes
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Validate presence and uniformity of conformal, hydrophobic and oleophobic coatings
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Eliminate delamination of electronic board stacks
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Validate surface cleanliness on wafers
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Alternative to ionic contamination testing
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Ensure uniformity of plasma treatment
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Verify ultrasonic cleaning is uniform and effective
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Confirm cleanliness of processing equipment such as chemical etching chambers, plasma treatment chambers, CVD and PVD
